SiTime is a leader in MEMS timing solutions, having shipped billions of units. Learn about our silicon MEMS oscillators, TCXOs, OCXOs, MEMS resonators, clock generators, jitter cleaners, clock timing, timing clock, sitm stock, and much more. Backed by NEA.
About the role
The Principal Semiconductor Package Engineer is responsible for the specification, design, development, and qualification of unique custom packaging technology for SiTime’s revolutionary MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules, all of which incorporate custom-designed MEMS and CMOS components. We value diverse experiences, perspectives, and career paths, and welcome candidates who are excited to contribute to our mission. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- M.S or PhD. Degree in Mechanical Engineering, Material Science, or other relevant field
- 10+ years’ experience in semiconductor IC packaging technology and methodology
- Experience managing overseas OSATs to bring products into production
- Knowledge of leadframe-based, flip-chip, and substrate-based packages
- Experience with flip-chip and bumping technologies
- Understanding of thermal, stress, and electrical considerations in package design
More about this role
SiTime is the Precision Timing company.
Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.
Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com .
The Principal Semiconductor Package Engineer is responsible for the specification, design, development, and qualification of unique custom packaging technology for SiTime’s revolutionary MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules, all of which incorporate...
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