Tenstorrent is a next-generation computing company that builds computers for AI. Headquartered in the U.S. with offices in Austin, Texas, and Silicon Valley, and global offices in Toronto, Belgrade, Seoul, Tokyo, and Bangalore, Tenstorrent brings together...
About the role
Tenstorrent is seeking a Layout Engineer with expertise in board layout for high-performance computing and AI hardware. This role requires direct experience with multi-layer boards, HDI vias, blind vias, back drilling, DFM, DFA and routing / layout of interfaces like GDDR, LPDDR, DDR, PCIe Gen 5 & 6, Ethernet IEEE 802.3bj, cd, cf, USB, etc.
What they're looking for
- Experienced board layout engineer with ~8+ years in PCB design (Cadence Allegro, Altium a plus)
- Hold a B.S. in EE, CS, or equivalent experience
- Strong background in high-speed, complex PCBs (high layer count, HDI, multi-lamination, VIPPO, back drilling)
- Comfortable defining and applying layout rules (physical, spacing, length-matching) for high-speed designs
- Confident working with fabricators on stackups, capabilities, and resolving DFM/DFA/DFT feedback
- Detail-oriented owner of designs with strong communication skills and the ability to work with an international, cross-functional team
More about this role
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
Tenstorrent is seeking a Layout Engineer with expertise in board layout for high-performance computing and AI hardware. This role requires direct experience with multi-layer boards, HDI vias, blind vias, back drilling, DFM, DFA and routing / layout of interfaces like GDDR, LPDDR, DDR, PCIe Gen 5 & 6, Ethernet IEEE 802.3bj, cd, cf, USB, etc. The ideal candidate will work closely with cross-functional teams consisting of engineers from systems, power, signal integrity and mechanical to ensure that our products meet the layout margins and cutting-edge...
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