Run full-resolution simulations in minutes. Vinci’s foundation model for physics unites AI acceleration with verified solvers for as-built accuracy. Backed by Khosla.
About the role
Strategic Account Mapping: Build and maintain deep relationships within a small pod of "Tier 1" semiconductor accounts, identifying the specific business units where Physics AI can deliver maximum ROI. This role is responsible for “land” and “expand” sales activities in each account. Full Sales Lifecycle Management: Lead the end-to-end sales process, from initial discovery and value proposition alignment to complex contract negotiations and closing multi-million dollar deals.
What they're looking for
- the product is not yet fully understood by the market – evangelical selling
- the buyer does not have a predefined budget or category
- and the sales motion requires shaping how customers think, not just what they buy – Challenger selling
- deeply technical IC
- domain experts
- executive leadership
More about this role
About Us
Vinci is building a new compute layer for engineering: a physics foundation model that makes high-fidelity physics continuously accessible across the hardware development lifecycle.
Today, the world’s most advanced semiconductors are still designed using workflows that assume physics is scarce, slow, and expert-gated. Simulation is run intermittently, often late in the process, limiting how much of the design space teams can explore and how early they can understand performance, reliability, and manufacturability.
Vinci changes that.
Our platform delivers deterministic, solver-grade physics simulation directly on native design and manufacturing geometry—at orders-of-magnitude higher throughput. In practice, this allows engineering teams to evaluate far more scenarios, surface issues earlier, and accelerate design cycles across thermal, packaging, and system-level challenges.
Vinci is already in active use within leading semiconductor organizations, with multiple pilots underway and a growing number converting into commercial engagements. Teams are deploying the platform on real design programs—particularly in thermal and advanced packaging workflows—and seeing measurable...
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