Run full-resolution simulations in minutes. Vinci’s foundation model for physics unites AI acceleration with verified solvers for as-built accuracy. Backed by Khosla.
About the role
As part of the Forward Deployment Sales team , you will play a key role in accelerating the adoption of Vinci’s software with leading engineering teams. You will work closely with prospective customers to demonstrate Vinci’s capabilities and show how the platform can significantly improve product design, thermal performance, time to market and reliability.
What they're looking for
- Degree in Mechanical, Electrical, or related engineering field
- 3+ years of hands-on mechanical analysis for warpage, stress and reliability using commercial softwares such as Ansys, Abaqus, LS dyna, etc
- Experience in Customer-facing roles
- Strong problem-solving mindset and ability to quickly learn new tools and workflows
- Strong ability to communicate complex results clearly to a mixed audience (technical + business)
- Familiarity with semiconductor electronics packaging, advanced packaging or foundry (chip warpage, wafer warpage, 2.5D/3D IC, etc.)
More about this role
We are building Physics AI for hardware design. Our product helps engineers explore, analyze, and optimize hardware systems, integrating cutting-edge AI with the realities of engineering design workflows.
As part of the Forward Deployment Sales team , you will play a key role in accelerating the adoption of Vinci’s software with leading engineering teams. You will work closely with prospective customers to demonstrate Vinci’s capabilities and show how the platform can significantly improve product design, thermal performance, time to market and reliability.
In this role, you will build and simulate t hermo-mechanical models based on customer designs to validate Vinci’s software and demonstrate its value in real-world engineering applications. You will apply your expertise in mechanical and thermo-mechanical analysis to evaluate warpage, stress behavior, and reliability in electronics packages, chips, and wafer-scale devices.
You will leverage a strong foundation in continuum mechanics to analyze complex physical phenomena, including linear and nonlinear behavior, geometric and material nonlinearities, and contact interactions, enabling accurate modeling of advanced semiconductor...
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