Astera Labs: Purpose-Built Connectivity for Rack-Scale AI.
About the role
Astera Labs is seeking a Principal Advanced Packaging Engineer to lead R&D for next-generation packaging technologies for optical chips. This is a senior individual contributor role focused on setting technical direction and driving packaging technology development for NPO and CPO products.
What they're looking for
- B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
- 8+ years of experience in semiconductor or advanced packaging engineering, with demonstrated technical leadership
- Deep expertise in advanced packaging processes, including 2.5D/3D integration, flip-chip, hybrid bonding, Cu pillar, TSV, RDL, and overmold across wafer-, panel-, and die-level flows
- Experience with silicon photonics chip packaging and EIC/PIC integration
- Hands-on experience with advanced packaging materials, including underfill, molding compounds, dielectrics, adhesives, or optical-grade encapsulants
- Proven track record of equipment and process qualification with OSAT or tool suppliers
More about this role
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com .
Astera Labs is seeking a Principal Advanced Packaging Engineer to lead R&D for next-generation packaging technologies for optical chips. This is a senior individual contributor role focused on setting technical direction and driving packaging technology development for NPO and CPO products.
- Lead R&D for advanced packaging of optical chips, including 2.1D, 2.5D, and 3D integration.
- Define and optimize...
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