Astera Labs: Purpose-Built Connectivity for Rack-Scale AI.
About the role
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI.
What they're looking for
- Define photonics package architecture, define electrical and optical interface specifications, and establish signal integrity and power integrity requirements
- Establish and manage Thermal Design Power (TDP) budgets and thermal performance targets
- Drive cross-functional alignment with EIC, PIC, and hardware teams on co-design constraints and drive system optical link budget
- Partner with validation, test, and reliability teams to define DFT and DFR requirements and acceptance criteria
- Finalize bump map and ball map, and manage ECOs and revision control of package design databases
- Lead package-level design reviews and own the package design technical roadmap
More about this role
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com .
About the Role
Astera Labs is seeking a Principal Photonics Package Architect to define and drive package architecture for next-generation photonics products for scale up and scale out AI infrastructure applications. This is a high-impact senior individual contributor role focused on aligning electrical, thermal, and mechanical design requirements across functions, enabling robust package implementation, and guiding...
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