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Technical Lead Package Platform Engineer

Astera Labs · San Jose, California, United States · On-site

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About Astera Labs

Astera Labs: Purpose-Built Connectivity for Rack-Scale AI.

About the role

We are seeking a L ead Package Engineer to drive the development, qualification, and manufacturing of advanced FCBGA packages. This role will drive package development from concept through NPI, qualification, and high-volume manufacturing, with strong ownership of technical execution, supplier management, project management, and package-related customer quality issues.

What they're looking for

  • Bachelor's degree or higher in a related field
  • Minimum of 5 years of professional experience in electronic packaging fields
  • Strong experience in FCBGA assembly manufacturing processes and laminate substrate technologies
  • Proven NPI development experience for advanced flip-chip packages, from early package definition through qualification and production release
  • Experience with package implementation from die netlist to flip-chip package design and manufacturing
  • Demonstrated experience managing substrate suppliers and assembly OSAT partners
More about this role

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com .

We are seeking a L ead Package Engineer to drive the development, qualification, and manufacturing of advanced FCBGA packages. This role will drive package development from concept through NPI, qualification, and high-volume manufacturing, with strong ownership of technical execution, supplier management, project management, and package-related customer quality issues.

The successful candidate will work closely with...

Read the full posting on Astera Labs's site ↗

Packaging

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