Broadcom delivers semiconductors and infrastructure software for global enterprises’ most complex, mission-critical needs.
About the role
Create and track project plans for 20+ concurrent designs (scope, schedules, resources) Improve scheduling methodologies and task tracking and coordination
What they're looking for
- Preferred candidates have previous experience managing package design projects
- Bachelors and 12+ years of related experience, or Masters degree and 10+ years of related experience
- Knowledge of package-level signal integrity and power integrity, to apply to package designs
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
- Self-management and organization skills
- This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position
More about this role
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Broadcom is seeking an experienced IC Package Design Project Manager to lead a team of engineers designing complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support the engineering team with project management, and opportunities to contribute to technical methodologies.
Create and track project plans for 20+ concurrent designs (scope, schedules, resources)
Improve scheduling methodologies and task tracking and coordination
Organize team and customer activities to keep projects on track
Communicate plans, status, next steps and risks
Create technical methodologies for package design
Steering...
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