Broadcom delivers semiconductors and infrastructure software for global enterprises’ most complex, mission-critical needs.
About the role
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What they're looking for
- Bachelor’s Degree in Mechanical Engineering and 8+ years of experience (or a Master’s Degree + 6 years of experience) developing semiconductor socket and cooling solutions
- In depth experience using Solidworks
- Experience using Ansys Icepack and/or Solidworks FLOW thermal analysis and simulation software
- Experience using Ansys mechanical simulation software
- Experience managing vendors in the test hardware manufacturing process
More about this role
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2. If you already have a Candidate Account, please Sign-In before you apply.
A mechanical engineering position responsible for developing thermal management and robust socketing solutions for test and validation PCBs for Broadcom ASIC products targeted at hyperscale data center applications. Broadcom’s market leading products are enabling the next generation of AI and cloud storage.
- Collaborate with PCB electrical design engineers to provide robust ASIC socket and thermal solutions for their designs.
- Perform mechanical component design and design verification using Solidworks.
- Perform 3d mechanical extractions from Allegro PCB design software.
- Interface with device package designers and generate device warpage profiles for socket designs from raw simulations data.
- Measure actual device warpage to validate warpage profile simulations using high precision profilometry equipment.
- Manage socket hardware vendors, review, provide feedback, and approve designs.
- Troubleshoot mechanical and electrical contact issues in lab and test floor...
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