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Principal Physical Design Engineer

Broadcom · USA-CA San Jose Innovation Drive · On-site

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About Broadcom

Broadcom delivers semiconductors and infrastructure software for global enterprises’ most complex, mission-critical needs.

About the role

Broadcom’s ASIC Products Division (APD) is looking for a Principal Physical Design Engineer to lead physical design implementation tasks for next-generation high-performance networking, AI/ML accelerators, and custom cloud ASICs. In this role, you will drive complex block-level floorplanning, synthesis, Place and Route (P&R), clock tree synthesis (CTS), timing closure, and signoff across cutting-edge deep sub-micron nodes (N5/N3/N2/A14). Found on 1752vc Careers, the job board for startup and VC roles.

What they're looking for

  • Education: B.S. or M.S. degree in Electrical Engineering, Computer Engineering, or a related technical field
  • Experience: 12+ years of hands-on physical design experience successfully taping out complex high-frequency, ultra-large-scale networking or AI ASICs
  • Deep Sub-Micron Expertise: Direct experience executing tapeouts in TSMC advanced nodes (N7, N5, N3) or equivalent foundry processes
  • EDA Tool Mastery: High proficiency in major physical design tool flows: P&R: Cadence Innovus
  • Timing/STA: Synopsys PrimeTime or Cadence Tempus
  • Extraction & IR/EM: StarRC / QRC, RedHawk
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Position Type: Full-Time

Broadcom’s ASIC Products Division (APD) is the global leader in custom high-performance silicon solutions. We partner with the world’s most innovative technology companies—spanning hyper-scale cloud providers, AI pioneers, and tier-1 networking infrastructure leaders—to co-design and manufacture complex, custom ASICs that power the modern digital backbone.

The Physical Design team within APD is the world-class execution engine behind the industry's most advanced custom silicon. We push the limits of silicon technology by combining deep architectural expertise, advanced IP, cutting-edge physical design methodologies in 3nm/2nm nodes, and advanced 2.5D/3D chiplet integration to solve the most demanding compute and bandwidth challenges.We transform ultra-complex architectures into fully realized, high-yielding, first-pass silicon success.

  • Pioneering First-Pass Silicon in 3nm/2nm: Our team consistently pushes the boundary of physics, taking the...

Read the full posting on Broadcom's site ↗

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