Cerebras powers the world's fastest AI inference on the biggest wafer chip. Cerebras CS-4 delivers up to 30x faster inference than GPUs.
About the role
- Solve complex signal integrity and power integrity problems for high‑speed AI compute platforms, including chip‑to‑chip and chip‑to‑board interfaces. - Perform advanced pre‑layout and post‑layout SI/PI analysis across PCBs, flex circuits, rigid‑flex assemblies, connectors, and advanced packages.
What they're looking for
- - Master’s degree in Electrical Engineering
- - 15+ years of demonstrated depth of expertise in system-level signal integrity and power integrity engineering for high‑speed hardware systems
- - Deep expertise in high‑speed serial and parallel interface analysis and debug
- - Strong hands‑on experience with PCB, rigid‑flex, and flex circuit stack‑up design and analysis
- - Advanced SI/PI analysis of flex connectors, high‑density interconnects, and advanced packaging technologies
- - Proficiency with 2D and 3D electromagnetic simulation tools
More about this role
Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. This architecture allows Cerebras to deliver industry-leading training and inference speeds; over 10 times faster than GPU-based hyperscale cloud inference services.
This order of magnitude increase in speed is transforming the user experience of AI applications, unlocking real-time iteration and increasing intelligence via additional agentic computation.
Cerebras works with the leading model labs, global enterprises, and cutting-edge AI-native startups. OpenAI recently announced a multi-year partnership with Cerebras, to deploy 750 megawatts of scale, transforming key workloads with ultra high-speed inference.
We are seeking an experienced System Signal Integrity and Power Integrity Engineer Lead to solve complex, high‑impact integrity challenges in next‑generation AI compute systems. This role is focused on deep technical analysis and hands‑on problem solving across high‑speed interfaces, power delivery networks, rigid and flex interconnects, and advanced packaging.
The ideal candidate is a technical expert engaged to resolve difficult SI/PI problems spanning silicon, package, PCB, flex, and...
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