Startups

Advanced Packaging Design Engineering Team Lead (Hybrid)

Cisco · San Jose, California, US · On-site

← All jobs
About Cisco

Cisco is a worldwide technology leader powering an inclusive future for all. Learn more about our products, services, solutions, and innovations. Backed by Sequoia and Menlo.

About the role

This role offers a unique opportunity to make a significant impact on the future of networking innovation within the Cisco Silicon One initiative. As a technical and team leader, you will drive complex package design programs—from planning and optimization to execution—ensuring the delivery of high-speed, robust, and scalable solutions for global networks. Found on 1752vc Careers, the job board for startup and VC roles.

What they're looking for

  • Bachelor’s degree in electrical engineering or a related field with 8+ years of relevant work experience or Master’s degree in Electrical Engineering or a related field with 6+ years of relevant work experience
  • Experience in high-speed package design, including signal integrity considerations and power distribution networks (PDN)
  • Experience with industry-standard EDA tools for package layout and design
  • Experience with technical leadership in complex hardware or silicon development programs
More about this role

The application window is expected to close on: 02/22/2027

This position requires that you live within commuting distance of our San Jose, CA office and commute to the office 4-5 days per week.

Cisco Silicon One (#CiscoSiliconOne) is a business organization with a long track record of building complex and high-performance Silicon ASICs. Our silicon devices drive the world’s most complex networks and carry over 90% of IP traffic. Cisco Silicon One is the only unifying silicon architecture in the market that enables customers to deploy the best-of-breed silicon from Top of Rack (TOR) switches all the way through web scale data centers and across service provider, enterprise networks, and data centers with a fully unified routing and switching portfolio.

We are a highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies for large-scale integration, using the latest signaling and data transfer technologies. Come join us and take part in shaping Cisco's ground-breaking solutions by designing, developing and testing some of the most complex ASICs being developed in...

Read the full posting on Cisco's site ↗

Build your edge while you search

Free tools for founders and investors, plus VC Unfiltered, our take on startups, venture and the people who build them.