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About the role
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.
What they're looking for
- • Bachelor’s with 5+ years of experience or Master’s degree with 3+ years of experience in Electrical Engineering or a related field
- • Experience in hardware, package, PCB, or high‑speed design engineering
- • Experience of high‑speed signaling, power delivery, and system-level hardware concepts
- • Prior experience with industry-standard EDA tools for package or PCB design
- • Experience in ASIC package design, PCB design, or related high‑speed hardware development
- • Experience with SI/PI concepts and collaboration with cross‑functional engineering teams
More about this role
The application window is expected to close on: 11/29/2026
The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco’s core Switching, Routing, and Wireless products for organizations globally. Our innovations in silicon, optics, and hardware platforms—like Silicon One—are shaping the technology industry. We're a global team of creative experts, bringing our unique backgrounds and bold ideas to push boundaries and help each other grow. Because full product development—from design to qualification to production—is within our team, we’re able to think differently, experiment more, and work quickly. Join us to power the future of the digital world.
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.
You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and...
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