Startups

IC Package Design Engineer

Cisco · San Jose, California, US · On-site

← All jobs
About Cisco

Cisco is a worldwide technology leader powering an inclusive future for all. Learn more about our products, services, solutions, and innovations. Backed by Sequoia and Menlo.

About the role

In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.

What they're looking for

  • • Bachelor’s with 5+ years of experience or Master’s degree with 3+ years of experience in Electrical Engineering or a related field
  • • Experience in hardware, package, PCB, or high‑speed design engineering
  • • Experience of high‑speed signaling, power delivery, and system-level hardware concepts
  • • Prior experience with industry-standard EDA tools for package or PCB design
  • • Experience in ASIC package design, PCB design, or related high‑speed hardware development
  • • Experience with SI/PI concepts and collaboration with cross‑functional engineering teams
More about this role

The application window is expected to close on: 11/29/2026

The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco’s core Switching, Routing, and Wireless products for organizations globally. Our innovations in silicon, optics, and hardware platforms—like Silicon One—are shaping the technology industry. We're a global team of creative experts, bringing our unique backgrounds and bold ideas to push boundaries and help each other grow. Because full product development—from design to qualification to production—is within our team, we’re able to think differently, experiment more, and work quickly. Join us to power the future of the digital world.

In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.

You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and...

Read the full posting on Cisco's site ↗

Build your edge while you search

Free tools for founders and investors, plus VC Unfiltered, our take on startups, venture and the people who build them.