Density shows you how people use your space and helps you get more out of every square foot. Backed by Kleiner Perkins and South Park Commons.
About the role
Own the technology roadmap, manufacturability, and quality of the advanced PCBs and package substrates that carry our AI accelerator silicon. You'll drive where our substrate and PCB technology is headed — embedded passives/actives, inorganic core substrates, and novel thermal solutions — while making sure complex, high-layer-count boards and flip-chip organic substrates are designed to build cleanly, at yield, and to spec. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- BS/MS in Electrical, Materials, Mechanical, or Manufacturing Engineering plus 5+ years in advanced PCB/substrate technology development, DFM, or manufacturing/supplier quality for complex electronics
- Strong grasp of advanced PCB and substrate fabrication processes (lamination, drilling/laser via, plating, ABF build-up, flip-chip BGA) and where they fail
- Experience partnering cross-functionally (packaging, SI/PI, thermal, mechanical, systems) to enable new product architectures, including embedded components and novel thermal solutions
- Supplier quality depth — qualification, PPAP/first-article, process capability, and driving corrective action with fab/substrate partners
- Fluency in IPC standards (e.g., IPC-6012 / IPC-A-600 or substrate equivalents) and quality acceptance criteria
- Failure-analysis skills: cross-section, metrology, and electrical debug to root-cause defects
More about this role
Own the technology roadmap, manufacturability, and quality of the advanced PCBs and package substrates that carry our AI accelerator silicon. You'll drive where our substrate and PCB technology is headed — embedded passives/actives, inorganic core substrates, and novel thermal solutions — while making sure complex, high-layer-count boards and flip-chip organic substrates are designed to build cleanly, at yield, and to spec. Partnering across packaging, thermal, and systems teams and directly with our substrate and PCB manufacturing partners, you'll develop and qualify the new materials, structures, and processes that enable next-generation product architectures — and protect product quality where the silicon meets the system.
- Drive the advanced substrate and PCB technology roadmap — including embedded passive/active integration and inorganic core substrates — aligned to our AI accelerator product needs
- Develop and qualify new materials, structures, and processes with substrate and PCB vendors, taking them from evaluation through production readiness
- Cowork with cross-functional teams (packaging, SI/PI, thermal, mechanical, systems) to improve and enable new product...
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