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About the role
In this role, you will lead the development, integration, and Release to Production of temporary wafer bonding, thinning, and debonding (TB/DB) processes for Google Quantum AI’s next-generation quantum processors. Responsibilities include developing and implementing process flows featuring advanced adhesive bonding chemistries, manufacturable debonding systems, and thin-wafer handling. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience
- 3 years of experience developing, sustaining, or integrating semiconductor fabrication processes in an research and development (R&D) or cleanroom production environment
- 3 years of experience in temporary wafer bonding, laser/thermal debonding, thin wafer handling, or back-end packaging processes
More about this role
- Develop, integrate, and transition to production temporary adhesive bonding and laser debond processes and equipment for advanced 3D Integration of quantum devices..
- Specify, bring up, and qualify required clean room equipment and advanced metrology capabilities, establishing baseline operational recipes and documentation.
- Drive process integration activities around wafer thinning, thin-wafer handling, and stress/warp mitigation.
- Coordinate vendor evaluations, off-site demos, technology transfers, and Release to Production of tools and processes into quantum device production processes.
- Troubleshoot processing anomalies, improve yield, and train cleanroom personnel and technicians on standard operating procedures.
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
- 3 years of experience developing, sustaining, or integrating semiconductor fabrication processes in an research and development (R&D) or cleanroom production environment.
- 3 years of experience in temporary wafer bonding, laser/thermal debonding, thin wafer...
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