Designed for your current needs and future ambitions, Marvell delivers the data infrastructure technology transforming tomorrow’s enterprise, cloud, automotive, and carrier architectures for the better.
About the role
The package engineering team drives semiconductor package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design that results in the delivery of engineering samples and a subsequent production ramp-up. There is the excitement of always working on new projects and cutting-edge technologies. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Experience managing high-performance technical teams
- Strong expertise with IC package layout tools, such as Cadence APD or Mentor XPD
- Ability to manage resources for IC package layouts across multiple product lines
- Experience with 2.5D package design for IC packaging technologies such as CoWOS
- Experience with IC package layout for high-speed SerDes interfaces, such as 224 Gbps
- Experience with IC package layout for die-to-die and HBM interfaces in 2D and 2.5D RDL interposers
More about this role
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
The package engineering team drives semiconductor package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design that results in the delivery of engineering samples and a subsequent production ramp-up. There is the excitement of always working on new projects and cutting-edge technologies.
The Manager will be responsible for managing the team that is involved in IC packaging layout for high speed 2D and 2.5D packages across multiple product lines. The manager will develop the team to do IC package...
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