Designed for your current needs and future ambitions, Marvell delivers the data infrastructure technology transforming tomorrow’s enterprise, cloud, automotive, and carrier architectures for the better.
About the role
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance‑driven systems. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- MS/PhD Electrical Engineering, Computer Engineering with relevant industry experience
- Strong understanding of transmission line theory & EM fundamentals
- Deep understanding of frequency and time domain analysis in high speed design
- Demonstrated ability to independently solve complex SI/PI problems
- Experience driving SI/PI design from architecture through implementation & validation
- Experience with developing SI/PI workflows and investigating tool trade-offs
More about this role
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance‑driven systems.
Within this ecosystem, Marvell’s central advanced packaging organization plays a critical role in delivering next‑generation connectivity and compute products. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced IC packages that support high‑speed interfaces. This work...
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