Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
As an HBM Design Architect, you will lead the technical enablement of novel memories and integration technologies — such as DRAM, gain-cell memory, stacked DRAM, and scaled-pitch hybrid bonding — grounded in a deep understanding of mainstream DRAM and HBM products. You will translate technology capabilities into product architectures, identify critical product requirements at risk, and drive de-risking plans with design, process, packaging, and product teams! Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- BS in Electrical Engineering, Physics, Materials Science, or related field with 7+ years of relevant experience, MS with 5+ years, or PhD with 3+ years
- Solid grounding in mainstream DRAM and/or HBM product architecture and design (array, periphery, datapath, timing, power)
- Deep understanding of DRAM or emerging memory cell and array operation (sensing, retention, disturb, variability)
- Working knowledge of semiconductor process technology and its impact on device and circuit behavior
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micron’s High Bandwidth Memory (HBM) Design Architecture team develops memory solutions for AI accelerators, high-performance computing, and data centers. Our Roadmap and Pathfinding group operates at the intersection of device technology, process, packaging, and product architecture, with a mission to enable next-generation memory technologies for product intercept.
As an HBM Design Architect, you will lead the technical enablement of novel memories and integration technologies — such as DRAM, gain-cell memory, stacked DRAM, and scaled-pitch hybrid bonding — grounded in a deep understanding of mainstream DRAM and HBM products. You will translate technology capabilities into product architectures, identify critical product requirements at risk, and drive de-risking plans with design, process, packaging, and product teams!
- Lead architecture and feasibility assessments for emerging...
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