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HBM SIPI, Staff Engineer

Micron Technology · 2 Locations · On-site

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About Micron Technology

Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.

About the role

We are seeking a SI/PI Engineer in HBM Build Architecture to develop high-quality SI/PI analysis for interposers, packages, and silicon channels. This work contributes directly to HBM build sign-off and product success. You will be involved in complex, multi-disciplinary SI/PI initiatives spanning multiple HBM product generations — from early interposer channel analysis and equalization co-design, PDN architecture, and system PI analysis. Found on 1752vc Careers, the job board for startup and VC roles.

What they're looking for

  • 5 years of experience in signal integrity (SI) and power integrity (PI) modeling and analysis
  • Deep understanding of SI/PI, electromagnetic and transmission line theory, I/O design
  • Experience in circuit simulation such as Keysight ADS and Synopsys HSPICE
  • Use AI/ML/LLM for productivity or efficiency
More about this role

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever ! The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using Through Silicon Via (TSV) technology, we stack multiple DRAM chips with a high-speed interface die, significantly increasing memory density and bandwidth for next-generation AI/ML accelerators and high-performance computing platforms. Our designs target the industry's lowest power-per-bit and highest bandwidth, enabling the most demanding compute workloads.

We are...

Read the full posting on Micron Technology's site ↗

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