Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
Join Micron’s Advanced Packaging Technology Development (TD) team, where innovation and precision come together to develop next-generation interconnect technologies. The team develops solutions designed to improve semiconductor performance, reliability, and advanced packaging capabilities. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Currently enrolled in an accredited university pursuing a Master’s degree or PhD in a semiconductor-related field, with an expected graduation date no earlier than Fall 2027 and no later than Summer 2028
- Demonstrated experience with data extraction, statistical analysis, and technical reporting using tools such as JMP or comparable analytics tools
- Demonstrated ability to collaborate and communicate technical findings across multi-functional teams
- Ability to prioritize multiple technical projects, adapt to changing responsibilities, and deliver results within project timelines and resource constraints
- Experience Using AI, Code Assist, or Agent-based solutions for technical analysis, engineering workflows, or related applications
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Join Micron’s Advanced Packaging Technology Development (TD) team, where innovation and precision come together to develop next-generation interconnect technologies. The team develops solutions designed to improve semiconductor performance, reliability, and advanced packaging capabilities.
As an Advanced Package TD Process Intern, you will collaborate with experienced engineers to support development of technologies including hybrid bonding, micro bump technology, Through-Silicon Vias (TSV), and thermal management. You will gain hands-on experience in structured problem-solving, line monitoring, data analysis, experimental design, and project management while contributing to process optimization and yield improvement. You will also leverage AI and Code Assist to develop Agent-based solutions that support engineering analysis and process development activities.
- Lead structured...
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