Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
This role provides an opportunity to explore HBM across multiple levels, from circuits and physical interconnects to memory architecture and AI systems. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Currently pursuing a Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, Applied Physics, or a related field
- Must be able to work onsite for six months and cannot graduate prior to the end of the internship
- Strong fundamentals in one or more areas including computer/memory architecture, analog or mixed-signal circuits, high-speed I/O, signal/power integrity, semiconductor packaging, or electrical modeling
- Experience with modeling, programming, simulation, or data analysis using tools such as Python, C/C++, MATLAB, SPICE, or similar environments
- Ability to learn new tools and work across different levels of hardware and system abstraction
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
The HBM Design Architecture team drives exploration and analysis of next-generation AI memory and system environments. The team partners across Design, Technology, Product, and System organizations to understand how evolving AI workloads, memory architectures, high-speed I/O, and advanced packaging shape future HBM solutions.
The HBM Design Architecture Intern will support early-stage research, modeling, and simulation to guide future HBM architectural decisions. Depending on the candidate's background, projects may span AI systems and workloads, memory architecture, high-speed I/O circuits, electrical interconnect modeling, silicon interposers, signal/power integrity, and advanced packaging.
This role provides an opportunity to explore HBM across multiple levels, from circuits and physical interconnects to memory architecture and AI systems.
- Research emerging trends in AI systems,...
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