Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Experience with analog and/or mixed-signal design, including simulation and floorplanning
- Experience with transistor-level simulation (e.g., FineSim, HSPICE) including corner analysis
- Ability to analyze architecture tradeoffs and use findings to develop specifications
- Experience with power delivery analysis, tradeoffs, constraints, and challenges
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications.
As a Senior Engineer, Principal Engineer, or Member of Technical Staff, Design Architect in the Next-generation HBM Architecture Team, you will design, simulate, analyze, and optimize the architecture of 3D-stacked, high-performance memories. Apply your knowledge to explore trade-offs in 3D-stacked logic and memory designs in close collaboration with peer architecture and design teams. Your responsibilities will include definition of, evaluation of, and specification of circuit implementations, technology requirements, thermal performance...
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