Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
As an HBM Design Architect, you will perform first-principles architecture analysis for current and future HBM/DRAM products — spanning dynamic power, PDN, thermal, timing, and area trade-offs — and run the circuit and CAD simulations needed to back them up. You will work closely with designers and technologists to develop architectural solutions, and your work will directly inform which architecture and technology options move forward toward product. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- BSEE or related field with 0–2 years of relevant experience, or MS/PhD with 0–2+ years
- Solid foundation in CMOS circuit design and device physics
- Working knowledge of DRAM fundamentals (cell/array operation, sensing, basic timing)
- Understanding of power delivery and power analysis (CV²f, leakage, IR drop) and thermal concepts for semiconductor dies
- Hands-on experience with circuit simulation (SPICE/HSPICE, FineSim, or equivalent) and Cadence Virtuoso or similar CAD environments
- Proficiency in Python, Tcl, Perl, or another scripting language
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micron’s High Bandwidth Memory (HBM) Design Architecture team develops memory solutions for AI accelerators, high-performance computing, and data centers. Within this team, our Roadmap and Pathfinding group identifies, assesses, and enables new memory and advanced packaging technologies for future HBM products, translating them into credible product architectures.
As an HBM Design Architect, you will perform first-principles architecture analysis for current and future HBM/DRAM products — spanning dynamic power, PDN, thermal, timing, and area trade-offs — and run the circuit and CAD simulations needed to back them up. You will work closely with designers and technologists to develop architectural solutions, and your work will directly inform which architecture and technology options move forward toward product.
- Perform architecture-level analysis for HBM/DRAM products, including...
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