Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
This role is focused on tapeout governance, release readiness, and execution rigor, from design freeze through final database release. The HBM Tapeout and Release Technical Lead plays a critical role in ensuring successful design releases into Micron manufacturing. In this role, you will drive tapeout execution, release readiness, and design governance across complex HBM programs, partnering with design, integration, verification, and product teams to deliver high-quality designs on schedule. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Bachelor’s degree in Electrical Engineering or a related field, or equivalent experience
- Proven experience with SoC, memory, or semiconductor tapeout execution and design release processes
- Strong knowledge of DBR processes, tapeout checklists, release governance, and signoff methodologies
- Hands-on experience preparing or reviewing TOAST, RCDB, TWIT, or equivalent tapeout artifacts
- Demonstrated ability to manage release readiness, risk tracking, and progress in deadline-focused environments
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Within Micron’s Heterogeneous Integration Group (HIG), we are developing advanced High Bandwidth Memory (HBM) solutions that enable the next generation of AI, high-performance computing, and data-centric applications.
We are seeking a Principal Engineer!
This role is focused on tapeout governance, release readiness, and execution rigor, from design freeze through final database release.
The HBM Tapeout and Release Technical Lead plays a critical role in ensuring successful design releases into Micron manufacturing. In this role, you will drive tapeout execution, release readiness, and design governance across complex HBM programs, partnering with design, integration, verification, and product teams to deliver high-quality designs on schedule.
- Lead tapeout execution and release coordination for HBM builds, managing schedules, DBR achievements, and release readiness
- Drive...
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