Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
As a Product Yield Enhancement (PYE) Electrical Failure Analysis (EFA) Engineer, you will work with a team dedicated to improving yields of next-generation memory products across all stages of the manufacturing lifecycle. Through failure analysis of test, internal qualification, and RMA failures, you will identify and help eliminate yield-limiting defects — driving enhanced product reliability, rapid production ramp, and early time to market. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related technical field
- 2+ years of experience in semiconductor failure analysis, yield enhancement, or a closely related field
- Hands-on experience with fault isolation techniques including emission microscopy, laser-based methods (OBIRCH/TIVA), and EOTPR
- Working knowledge of CMOS fabrication processes and package assembly flows
- Proficiency in reading and interpreting semiconductor layout and schematic designs
- Experience with Physical Failure Analysis (PFA) tools and de-processing techniques (e.g., FIB, cross-section, delayering)
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Product Yield Enhancement (PYE) Electrical Failure Analysis (EFA) Engineer, you will work with a team dedicated to improving yields of next-generation memory products across all stages of the manufacturing lifecycle. Through failure analysis of test, internal qualification, and RMA failures, you will identify and help eliminate yield-limiting defects — driving enhanced product reliability, rapid production ramp, and early time to market. Your day-to-day work will center on fault isolation using a combination of electrical and physical characterization techniques paired with data analysis to pinpoint physical defects introduced during process fabrication or package assembly. You will also be responsible for presenting and coordinating failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams to ensure corrective actions are implemented and...
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