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Director, Package Design Engineering

Renesas Electronics · Austin, TX · On-site

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About Renesas Electronics

Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...

About the role

Are you ready to join our team and shape the future with us?

What they're looking for

  • Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
  • 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
  • Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
  • Knowledge of wire-bonding & multi-chip module technologies a plus
  • Strong interpersonal and communication skills
  • Strong analytical and presentation skills
More about this role
  • Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.
  • Focus on design and development of package and interconnect methods for Renesas’s AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages. Scope also involves WBG (Ie. SiC & GaN) development along with DBC, AMB substrates and advanced interconnect technologies. Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
  • Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps.
  • Establish production controls and monitors to ensure there is no room for quality incidents.
  • Ensure smooth transition...

Read the full posting on Renesas Electronics's site ↗

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