About Renesas Electronics
Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus. Are you ready to join our team and shape the future with us? Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
- 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging
- Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus
- Strong interpersonal and communication skills
- Strong analytical and presentation skills
More about this role
- Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging.
- Package technologies qualification for consumer & industrial power as well as automotive power applications.
- Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
- Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
- Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
- Resolve all process integration issues by ensuring all window checks are done on critical process steps.
- Establish production controls and monitor to ensure there is no room for quality incidents.
- Ensure smooth transition into production & implement ramp up monitor.
- Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
- Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level...
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