Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
We are seeking a Principal Package Design Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architecture, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, applications, product engineering, manufacturing, suppliers, and quality teams.
What they're looking for
- Required Qualifications
- Education: MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field
- Experience: 5+ years of experience in advanced semiconductor packaging or advanced electronics packaging and system integration
- Technical Depth: Strong hands-on knowledge of advanced packaging technologies, materials, assembly processes, and application system integration as they apply to AI infrastructure and data center power management
- Supply Chain: Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains
- Problem Solving & Leadership: Proven ability to troubleshoot packaging failures, drive root cause/corrective action, and demonstrate strong project leadership and cross-functional communication skills
More about this role
Principal Package Design Engineer
Position Summary
We are seeking a Principal Package Design Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architecture, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, applications, product engineering, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production.
Key Responsibilities
Lead Advanced Packaging Initiatives: Lead the design, development, and qualification of advanced semiconductor packaging solutions, including:
Flip-chip, Chip Embedding
Wafer-level packaging (WLP/FOWLP)
Panel-level packaging (laminate, molding)
2.5D/3D packaging
System-in-package (SiP)
Ball grid array (BGA/CSP)
Wafer-to-wafer and die-to-wafer heterogeneous bonding
Architecture & Simulation: Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements...
Browse similar: Startup jobs