Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
You will be responsible for technology development tasks in the assembly and packaging of advanced semiconductor packages for AI, HPC (High Performance Computing), automotive, and IoT advanced semiconductor packages (such as Flip Chip Scale Package, Flip Chip Ball Grid Array, and Power Semiconductor Package). Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Over 5 years of experience in technology development in semiconductor back-end processes (assembly and packaging)
- Over 5 years of technical development experience in any of the processes of Ball Mount, Reflow, Flux cleaning, or Marking
- Practical experience in process improvement, quality control, and equipment introduction
- Technical degrees (mechanical, materials, electronics, chemistry, etc.)
- Business-level proficiency in both Japanese and English
- Practical experience in analyzing and improving defects using FTA, 5 Whys, etc. in subsequent processes
More about this role
You will be responsible for technology development tasks in the assembly and packaging of advanced semiconductor packages for AI, HPC (High Performance Computing), automotive, and IoT advanced semiconductor packages (such as Flip Chip Scale Package, Flip Chip Ball Grid Array, and Power Semiconductor Package).
- Development, equipment selection and implementation of assembly technologies for advanced packages such as VPS, FCOSP, and FCBGA
- Development and improvement of materials and processes for assembly processes (Molding, Ball mount, Marking, PKG saw)
- Support for Launching and Transitioning to Mass Production Lines
- Process quality and yield improvement activities
Our company is driving innovation in semiconductor packaging technologies, including Flip Chip, SiP, VPS, FCOSP, and FCBGA. As demand continues to grow in AI, HPC, automotive, and IoT applications, advanced packages with higher density, improved thermal performance, and greater reliability are becoming increasingly important.
To support the rapid expansion of these technologies, we are seeking experienced engineers in semiconductor assembly and packaging processes. In this role, you will contribute to the...
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