Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
• Take on a leadership role within the design team as your experience grows. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Ability to understand the Renesas Culture principles of Transparent, Agile, Global, Innovative, and Entrepreneurial, and act in accordance with these values
- At least three years of practical experience in semiconductor package design
- At least three years of practical experience in high-speed or high-frequency electrical design
- At least three years of practical experience in semiconductor package design at a semiconductor manufacturer
- At least three years of experience using electromagnetic field simulation tools such as HFSS and Q3D
- At least three years of experience using high-frequency circuit simulation tools such as ADS and HSPICE
More about this role
• Lead semiconductor package design in collaboration with IC design engineers to optimize product cost and performance.
• Lead the layout design of package substrates and printed circuit boards for reference designs for semiconductor products incorporating high-speed memory interfaces and high-speed serial communication circuits.
• Investigate technology trends in semiconductor packages and printed circuit boards, and propose and develop design technologies required for next-generation products.
• Take on a leadership role within the design team as your experience grows.
【MUST】
• Ability to understand the Renesas Culture principles of Transparent, Agile, Global, Innovative, and Entrepreneurial, and act in accordance with these values
• At least three years of practical experience in semiconductor package design
• At least three years of practical experience in high-speed or high-frequency electrical design
【WANT】
• At least three years of practical experience in semiconductor package design at a semiconductor manufacturer
• At least three years of experience using electromagnetic field simulation tools such as HFSS and Q3D
• At least three years of experience using high-frequency...
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