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Senior Director, Package Design Engineering

Renesas Electronics · Austin, TEXAS · On-site

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About Renesas Electronics

Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...

About the role

The Sr. Director, Technical Program Management will lead a global technical program management organization responsible for driving execution of strategic AI/Datacenter Infrastructure Power package engineering and new product introduction (NPI) programs.

What they're looking for

  • QUALIFICATIONS
  • Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline
  • 15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field
  • Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp
  • Strong understanding of semiconductor product development process, package and assembly processes
  • Experience in Power Management products, particularly power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management system, PMICs, wafer-level and/or flip-chip technologies
More about this role

The Sr. Director, Technical Program Management will lead a global technical program management organization responsible for driving execution of strategic AI/Datacenter Infrastructure Power package engineering and new product introduction (NPI) programs. This leader will partner closely with Package Engineering Directors, Power product group partners—especially Design, Application, and Marketing teams—Product, Reliability, Quality, Operations, Supply Chain, and key OSAT/CM partners to ensure programs meet committed schedules, quality and reliability objectives, and production readiness requirements. The role will establish strong program governance, identify and escalate critical risks early, and lead cross-functional technical task forces to resolve development challenges that threaten quality, reliability, yield, manufacturability, or schedule.

The organization will also provide technical program management leadership at key OSATs, ensuring consistent execution, issue escalation, and alignment between Renesas development teams and external assembly partners.

KEY RESPONSIBILITIES

Lead the global Technical Program Management (TPM) organization supporting AI/Datacenter...

Read the full posting on Renesas Electronics's site ↗

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