Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
Lead package technology development and NPI execution, including R&D activities, coordination with global OSAT partners for new package development and product qualification, technology roadmap implementation, project budget tracking, and customer adoption programs. Manage the design and development of package and interconnect solutions for Renesas AI and data center infrastructure power products, including Smart Power Stages, Vertical Power Stages, Power Modules, and discrete FET packages. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Master’s or Bachelor’s Degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related discipline, doctorate is a plus
- 12 to 15 years of relevant semiconductor package development experience, including technical or project leadership responsibility, with emphasis on power SiP/modules, wafer-level packaging, and flip-chip packaging
- Demonstrated ability to lead cross-functional technical teams, manage multiple development programs, influence global manufacturing partners, and escalate risks with clear recovery plans
- Strong interpersonal, written, and verbal communication skills
- Strong analytical, problem-solving, project management, and presentation skills
More about this role
Lead package technology development and NPI execution, including R&D activities, coordination with global OSAT partners for new package development and product qualification, technology roadmap implementation, project budget tracking, and customer adoption programs.
Manage the design and development of package and interconnect solutions for Renesas AI and data center infrastructure power products, including Smart Power Stages, Vertical Power Stages, Power Modules, and discrete FET packages.
Support wide-bandgap SiC and GaN package development, DBC and AMB substrates, advanced interconnect technologies, wafer-level packaging, flip-chip, multi-chip modules, and power devices.
Evaluate, select, and qualify materials, processes, assembly subcontractors (OSATs), and contract manufacturers in alignment with product requirements, quality standards, cost targets, and capacity needs.
Partner with OSATs and contract manufacturers to plan and execute DOEs, optimize assembly processes, establish process specifications, and close technical gaps.
Coordinate with Product Groups, Design, Applications, Quality, Operations, and Reliability teams to qualify new packages and processes within...
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