Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline
- 15+ years of semiconductor manufacturing and packaging engineering experience with strong exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers
- 3+ years of experience leading technical projects, mentoring engineers, or managing small engineering teams in semiconductor manufacturing environments
- Deep understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools
- Experience working with global OSAT partners and outsourced manufacturing ecosystems, including benchmarking, selection, qualification, and ongoing technical management of subcontractors and contract manufacturers
- Demonstrated experience supporting successful NPI-to-HVM product ramp execution
More about this role
We are seeking an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and high-volume manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This position will focus on yield performance, process stability, quality control, process change management, and manufacturing readiness while working closely with Package Engineering, R&D, Product Engineering, Quality, Supply Chain, and external OSAT partners to transition New Product Introduction (NPI) programs into scalable high-volume manufacturing (HVM).
The ideal candidate combines strong semiconductor packaging assembly expertise with hands-on technical execution, data-driven problem solving, and cross-functional collaboration skills to improve manufacturing performance, product quality, and process robustness across global...
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