About Renesas Electronics
The Senior Packaging NPI Staff Engineer is responsible for leading Wafer-Level Chip-Scale Package (WLCSP) new product introduction activities from development through volume production.
About the role
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What they're looking for
- Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field
- Typically 10+ years of experience in semiconductor packaging, with strong focus on WLCSP and board-level reliability
- Prior experience in NPI, package engineering, or customer-facing technical roles preferred
More about this role
- NPI, Reliability & Technical Leadership Own WLCSP package and process readiness from development through mass production.
- Define and control assembly flow, critical process parameters, materials, and reliability risks.
- Serve as final technical authority for WLCSP-related decisions impacting quality, yield, cost, and reliability.
- Board Level Reliability (BLR) & Failure Analysis Leadership Own BLR test strategy definition, execution alignment, and technical interpretation.
- Lead failure mechanism identification, root cause analysis, and corrective action definition.
- Correlate package design, material properties, process variables, and PCB interactions to BLR performance.
- Customer Technical Interface & Program Leadership Act as primary customer-facing technical lead for WLCSP NPI and reliability topics.
- Host and lead customer technical reviews, BLR updates, and issue resolution meetings.
- Ensure customer confidence through clear communication, data-driven analysis, and timely follow-up.
- Cross-Functional & Global Team Coordination Coordinate global, cross-functional teams across engineering, QA, manufacturing, and supply chain.
- Drive alignment on schedule,...
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