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Senior Staff Package Design Engineer

Renesas Electronics · Austin, TEXAS · On-site

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About Renesas Electronics

Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...

About the role

Are you ready to join our team and shape the future with us? Found on 1752vc Careers, the job board for startup and VC roles.

What they're looking for

  • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging
  • Package technologies qualification for consumer & industrial power as well as automotive power applications
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM)
  • Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps
More about this role
  • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging.
  • Package technologies qualification for consumer & industrial power as well as automotive power applications.
  • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
  • Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
  • Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
  • Resolve all process integration issues by ensuring all window checks are done on critical process steps.
  • Establish production controls and monitor to ensure there is no room for quality incidents.
  • Ensure smooth transition into production & implement ramp up monitor.
  • Work with OSAT/CM to monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer.
  • Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.

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Read the full posting on Renesas Electronics's site ↗

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