Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus. • Package technologies qualification for consumer & industrial power as well as automotive power applications. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
- 10 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
- Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
- Strong interpersonal and communication skills
- Strong analytical and presentation skills
- Knowledge of wire-bonding & multi-chip module technologies is a plus
More about this role
• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus.
• Package technologies qualification for consumer & industrial power as well as automotive power applications.
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM to develop, run DOE to optimize processes, establish process spec & monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer.
• Work with Product groups and Reliability team, qualify new packages and processes within required time frame & further address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
• Ensure smooth transition into production & implement ramp up monitor.
• Participate in packaging roadmap development & focus on execution, develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level...
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