Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
Are you ready to join our team and shape the future with us? Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- BS Degree in Electrical Engineering, Mechanical Engineering and Material Science
- Minimum experience 15 years in semiconductor packaging technology with hands-on design for manufacturability (Process Development & Package Development Engineer)
- Excellent people & leadership skills and experience in dealing with and managing OSATs
- Substantial experience in Power discrete products with multi die & stacked die configuration, Ag sintered die bonding, Al, Cu/PCC bonding, Cu clip, flip chip LGA and QFN technologies and low stress vacuum molding
- Can perform actual hands-on process capability analysis & risk prediction, design of experiments, variability charting, analysis of variance/means comparison/T-tests using SAS.JMP or mini tab software
- Experience leading a project (program management)
More about this role
This senior technical contributor role will design, develop and resolve issues on advanced packages for high performance power semiconductor products with high reliability, low cost and mass production robustness by collaborating with multiple departments (Design, Assembly, Test, Reliability Engineering, Quality, Sales and Marketing Team) and suppliers/OSAT’s around the world.
- Responsible for packaging design and technology development on advanced high power discrete, muti-chip, stacked and module packages.
- Responsible for defining package design rules, process flow and material set for new products including automotive power packages.
- Analyze stress, thermal capability and electrical performance with in-depth knowledge of thermal-mechanical and electro-chemical interactions.
- Define BOM, assembly process development, assembly specification and qualification per standard requirements.
- Run process DOE’s to define optimum process windows and material characteristics on existing assembly processes and for new package development.
- Resolve package reliability, assembly issues and improving existing assembly processes & materials working with OSATs across Asia to achieve...
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