We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types.
About the role
Are you ready to join our team and shape the future with us? Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Degree (Bachelor’s, Master’s, or PhD) in Electrical, Electronics, or a related engineering discipline
- 10+ years of IC package design experience
- Expertise in WLCSP, BGA, FCCSP, SiP, QFN/DFN, and leadframe-based package technologies
- Proficiency in Cadence APD/SIP and AutoCAD
- Strong understanding of package design, including complex structures, and manufacturability
- Excellent communication and teamwork skills
More about this role
1. Design IC semiconductor packages, including WLCSP, BGA, FCCSP, SiP, QFN/DFN, and leaded leadframe-based packages (SOP, T/M/V/SSOP, QFP, PDIP, SOT23), to meet manufacturing and reliability requirements.
2. Create package layouts using Cadence APD/SiP and AutoCAD in compliance with company standards and design rules.
3. Collaborate with cross-functional teams including Product Group, Package Development, Package Documentation, Package Simulation, IC Layout Design, Analog/RF/Digital Design, Assembly Engineering, Project Management and OSATs to ensure successful package execution.
4. Drive package design activities from concept and feasibility through production, providing technical solutions and resolving design challenges.
5. Optimize package designs to meet electrical, mechanical, thermal, and manufacturability requirements.
- Degree (Bachelor’s, Master’s, or PhD) in Electrical, Electronics, or a related engineering discipline.
- 10+ years of IC package design experience.
- Expertise in WLCSP, BGA, FCCSP, SiP, QFN/DFN, and leadframe-based package technologies.
- Proficiency in Cadence APD/SIP and AutoCAD.
- Strong understanding of package design, including complex structures,...
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