Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC), and Vertical Power Delivery (VPD) are rapidly increasing their demand for higher density, higher reliability, and high thermal dissipation package technologies. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
- 5-15 years of relevant experience in package development emphasizing leadframe, laminate, power QFN/SiP/module, flip-chip packaging, and wafer Front-Side (FSM) / Back-Side (BM) Metallization processing
- Strong interpersonal and communication skills
- Strong analytical and presentation skills
More about this role
We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC), and Vertical Power Delivery (VPD) are rapidly increasing their demand for higher density, higher reliability, and high thermal dissipation package technologies.
This role offers the opportunity to work on cutting edge technologies — such as power packages for AI/HPC, VPD, Server VR core/peripheral, and Accelerator/GPU markets — and contribute to the development of packaging technologies that underpin innovations shaping society, including AI and next generation mobile computing.
- Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging
- Work with OSAT/CM to develop, run DOEs to optimize processes and establish process specifications.
- Work with Product Groups and Reliability teams to qualify new packages and processes within required time frame.
- Ensure smooth transition into production by resolving all process...
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