About the role
To strengthen leadership in the DRAM-on-Logic era through optimized DRAM die design, we are seeking talent capable of driving the co-design of 3D-stacked DRAM logic dies in close collaboration with U.S.-based customers. This strategic hiring initiative aims to enhance our global competitiveness by fostering deep engagement with key American clients, ensuring that our die design solutions are precisely aligned with their evolving technical requirements and market demands.
What they're looking for
- Bachelor’s degree or higher in Electrical Engineering or a related discipline with 4+ years of relevant experience
- Development of DRAM and design DRAM circuit based on custom design methodology (using virtuoso [or similar tools], spice simulator)
- Experience reviewing DRAM specifications and architecture
- Circuit design experience to meet internal and external requirements for DRAM products
- Experience evaluating compliance with DRAM specifications through design analysis at the wafer levels test / package levels test / system level test
- Experience in full custom + digital Co-design and PDN analysis
More about this role
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
Job Title: 3D Stacked DRAM Design Engineer
Office Location: San Jose, CA
Job Type: Full-Time
Work Model: Onsite
To strengthen leadership in the DRAM-on-Logic era through optimized DRAM die design, we are seeking talent capable of driving the co-design of 3D-stacked DRAM logic dies in close collaboration with U.S.-based customers. This strategic hiring initiative aims to enhance our global competitiveness by fostering deep engagement with key American clients, ensuring that our die design...
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