About the role
SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.
What they're looking for
- BS in Electrical Engineering or equivalent combination of education and progressive industry experience
- 7+ years of specialized experience in advanced packaging architecture definition, strategy, and development
- Demonstrated success in driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions
- Proven track record of leading, mentoring, and scaling high-performing engineering teams, with experience managing managers or team leads preferred
- Exceptional verbal and written communication skills, with the ability to articulate technical strategies
More about this role
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
- Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM).
- Drive mechanical and electrical test vehicle design and development when necessary.
- Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments.
- Lead strategic collaborations with internal teams and...
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