About the role
We are seeking a skilled Package Designer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density semiconductor packages for next-generation semiconductor products. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions.
What they're looking for
- Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Materials Science, or a related field
- 3+ years of experience in semiconductor package design or layout
- Proven experience with package layout tools (Cadence Allegro/Virtuoso/Innovus, Siemens Xpedition, Synopsys 3D-ICC, Autocad or equivalent)
- Strong understanding of high-speed signal routing and power distribution networks (PDN)
- In-depth knowledge in 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
- Effective communication skills and ability to work in a fast-paced, cross-functional environment
More about this role
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
We are seeking a skilled Package Designer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density semiconductor packages for next-generation semiconductor products. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions.
- Design and layout of advanced semiconductor packages including Flip Chip, BGA, LGA, 2.5D/3D...
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