Syenta is architecting the future of AI computing through its revolutionary Localized Electrochemical Manufacturing (LEM) technology, which enables High-Resolution Interconnects -a new class of chip-to-chip connections that transcends traditional packaging... Backed by Blackbird Ventures.
About the role
We are seeking a Senior Process Engineer (Substrate) to support the development of Syenta's advanced packaging toolset. In this hands-on role, you will develop critical components of the toolset, focusing on process development of (1) Photo Imageable Dielectric (PID) coating and patterning of precise, fine-line circuitry, and (2) Wafer Level Processing, including photolithography, etching, thin film deposition, wet processing, and metrology verification. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- Bachelor's degree in physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field
- Minimum 7 years of combined experience in microfabrication processes with demonstrated cleanroom proficiency from either an academic or industry background, and the ability to support seamless process integration
- Hands-on experience with commonly used photoresist coating, exposure, and development tools and processes
- Knowledge of PID materials for interposer buildup
- Experience with etching processes (ICP, RIE, CCP, and wet etching)
- Experience in metallization and thin-film deposition (PECVD, PVD, etc.)
More about this role
About Syenta
Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localized Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.
Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.
We are seeking a Senior Process Engineer (Substrate) to support the development of Syenta's advanced packaging toolset. In this hands-on role, you will develop critical components of the toolset, focusing on process development of (1) Photo Imageable Dielectric (PID) coating and patterning of precise, fine-line circuitry, and (2) Wafer Level Processing, including photolithography, etching, thin film deposition, wet processing, and metrology verification.
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