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Senior Heterogenous Integration Process Engineer

Tokyo Electron · Albany · On-site

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About the role

Let’s search for your next career at TEL. Use the form below to search our current opportunities and then apply. Please consider joining our Talent Community so that we may continue to engage with you.

More about this role

Let’s search for your next career at TEL. Use the form below to search our current opportunities and then apply. Please consider joining our Talent Community so that we may continue to engage with you.

TEL Technology Center, America (TTCA) is TEL's advanced R&D center in the United States, driving innovation in next-generation semiconductor process technologies and equipment solutions. Leveraging expertise in semiconductor processing, materials science, device integration, and equipment engineering, TTCA collaborates with customers, research institutions, and TEL's global R&D network to solve critical technology challenges. From concept development to manufacturing enablement, our team develops innovative solutions that support future semiconductor technology roadmaps and advance semiconductor manufacturing worldwide.

Group/Role Overview

The 3DI Technology Group at TEL Technology Center, America (TTCA) develops next-generation heterogeneous integration and 3D device integration technologies for future semiconductor applications. Our focus includes fusion bonding, hybrid bonding, wafer-to-wafer (W2W) and chip-to-wafer (C2W) integration, wafer thinning, and TSV technologies,...

Read the full posting on Tokyo Electron's site ↗

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